FPC Lamination Accessories – Optimized for Flexible Circuit Manufacturing
Henan Huanyuchang Electronic Technology Co., Ltd was established in 2009, headquartered in Shenzhen, factory in Henan. The company has a total investment of 200 million and covers an area of more than 78000 square meter. In the Henan factory, we have a mature R&D team, first-class production equipment, and high-level production workshops, and we continue to develop new and durable laminate products.It mainly produces electronic composite materials with high temperature and pressure resistance cushion ( Nawes Mat ) Pad, Japan Nippon Yakin pressing steel plate, Sweden Hardox Carrier plate, resistance film, release film and other products.
We provides precision-engineered lamination press materials tailored for FPC (Flexible Printed Circuit) production. Due to the thin, delicate nature of flexible substrates, FPC lamination demands highly stable and evenly distributed pressure, accurate stack-up, and clean separation.
🧩 Our FPC Lamination Products:
Cushion Pad for FPC Lamination
Flexible, high-temperature-resistant material that cushions the substrate during pressing, absorbs pressure variation, and prevents wrinkling or delamination of the FPC layers.
Separator Plate
Smooth, flat stainless steel or aluminum plates offer uniform pressure and heat transfer across the FPC stack, ensuring dimensional accuracy and surface smoothness.
Tooling Plate
Customized for FPC press configurations, these plates ensure alignment of delicate layers, reducing press misregistration and increasing production yield.
Release Film
Designed to prevent resin overflow and contamination, our heat-resistant release film ensures clean separation and protects both boards and press plates.
🔧 Why Our Accessories Are Ideal for FPC Production:
High flexibility and thermal resistance
Pressure absorption for fragile substrates
Improved product yield, fewer lamination defects
Compatible with hot press cycles used in FPC & HDI lines
🌍 Serving the Global FPC Industry
We support manufacturers of mobile device PCBs, camera modules, flex-rigid boards, and wearable electronics, offering consistent lamination performance and material reliability.
