Products

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Special Materials For Pressing

Special Materials For Pressing

FPC Lamination Process Materials

FPC Lamination Process Materials

High Expansion Coefficient Steel Plate

High Expansion Coefficient Steel Plate

Silicone Cushioning Pad

Silicone Cushioning Pad

FPC Special High Temperature And Pressure Buffer Pad

FPC Special High Temperature And Pressure Buffer Pad

PCB Lamination Press Pad

PCB Lamination Press Pad

FCCL Special High Temperature And Pressure Buffer Pad

FCCL Special High Temperature And Pressure Buffer Pad

PCB Special Laminated High-temperature Resistant Carrier

PCB Special Laminated High-temperature Resistant Carrier

Lamination Process Materials

Lamination Process Materials

PCB Dedicated High Temperature And Pressure Buffer Pad

PCB Dedicated High Temperature And Pressure Buffer Pad

Contact us

Address

Wuhua Road and Baocheng Road intersection southwest corner road west 10 meters，Ru'nan County,Zhumadian City, Henan Province

Email

sales@henanhyc.com、lucky@henanhyc.com、ywb4@szhycdz.com

Phone

+86-13510150278、+86-17739688867、+86-13788325233

Fax

Ccl Lamination Cushion Pad

CCL Pressed Cushion
The CCL Pressed Cushion is a state-of-the-art high-temperature buffer material designed to meet the rigorous demands of the 5G electronics industry. Composed of special-grade glass fiber cloth and high molecular polyme.

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