Pressing buffer pad ( suitable for PCB, IC carrier board )
Following the launch of cushioning pads for the CCL industry, we have now introduced the second-generation cushioning pads tailored for the PCB and IC carrier board sectors. This new product, crafted from high-elasticity fibers and advanced polymers, delivers enhanced cushioning performance compared to its first-generation predecessor.
| PerformanceCategory | Flatness | Roughness | Wear resistance | Size shrinkage | Thickness change | Buffer performance | High temperature resistance | Number of recommendations |
| Red hard pad for PCB | ★ | ❏ | ★ | ★ | ★ | ★ | ★ | 200-500 |
| Red hard pad Applicable to IC carrier board | ★ | ❏ | ★ | ★ | ★ | ★ | ★ | 200-400 |
| kraft paper | ❏ | ★ | ❏ | ★ | ❏ | ❏ | ⊙ | 1-5 |
Excellent ★ Good ❏ Poor⊙
This product currently stands as the optimal alternative to kraft paper and silicone pads. Primarily designed for the pressure equalization process in PCB and IC carrier board manufacturing, it offers excellent thermal conductivity and effectively addresses adhesive insufficiency issues, such as those related to thick copper layers and low residual copper rates.
Enhanced High-Temperature ResistanceCapable of operating continuously at 260°C without carbonization or brittleness.
Superior Buffering and Thermal PerformanceOffers excellent cushioning effects, uniform heat conduction, stable compression shrinkage, consistent expansion coefficient, and high tear resistance.
Exceptional Durability and SafetyResistant to pressure (200–500 cycles), flame-retardant, non-toxic, odorless, dust-free, and breathable.
Independent R&D and Agile ProductionDeveloped and manufactured in-house with short production cycles, supported by responsive technical services.
Customizable and Intelligent DesignAvailable in thicknesses ranging from 1.0mm to 10mm, tailored to meet specific customer needs, with intelligent usage tracking capabilities.
Delivers premium quality at a competitive price.
Product structure
It is suitable for mid-layer physical cushioning and can replace manual operations in multi-sheet applications. It is also automation-compatible, enabling a single sheet to replace multiple layers of kraft paper on surface treatments.
Comparison of products with kraft paper
| Compare Item 1 | Navies pad | Bullskin paper | Compare Item 2 | Navies pad | Bullskin paper |
| Chi An | ◎ | ◯ | Heat preservation effect | ◎ | ◯ |
| Life | ◎ | ▲ | Homogeneity of dielectric layer | ◎ | ◯ |
| Pressure buffering | ◎ | ◯ | Impedance controllability | ◎ | ◯ |
| Pressure uniformity | ◎ | ▲ | Plate thickness uniformity | ◎ | ◎ |
| Pressure transfer stability | ◎ | ▲ | Thick copper adaptability | ◎ | ▲ |
| Heat buffering | ◎ | ◎ | Chip cost | ◎ | ▲ |
| Heat transfer uniformity | ◎ | ◎ | Storage convenience | ◎ | ▲ |
| Heat conduction efficiency | ◎ | ▲ | Operation convenience | ◎ | ▲ |
| Processing efficiency | ◎ | ◯ | Cleanliness | ◎ | ▲ |
| Heat resistance | ◎ | ◯ | Recycling and reuse | ◯ | ◎ |
| Moisture resistance | ◎ | ▲ | Cost-effective | ◎ | ▲ |
◎：Excellent ◯：Good ▲：Poor
Based on the specific operational conditions of our customers, our company develops customized cost-saving solutions. According to current client data, these solutions can achieve a cost reduction of 10% to 20% compared to the use of conventional kraft paper.
Summary
1. Functional Features and Technological InnovationTo break the long-standing foreign monopoly in cushioning technology, our company has introduced advanced international products and collaborated with the Chinese Academy of Sciences to conduct thorough research, analysis, refinement, and experimental verification. This process has enabled us to master comprehensive cushion production technology, filling the domestic gap in pressing cushion manufacturing. The resulting product represents the only innovative material capable of effectively replacing both kraft paper and silicone pads.Amid rising material costs across the industry due to global trends, our cushion offers reusable functionality that meets customer needs while significantly reducing operational expenses.3. Environmental SustainabilityBy replacing traditional kraft paper and silicone pads, our cushion contributes to ecological stability—helping mitigate the greenhouse effect and reduce soil erosion. Composed of high-elasticity fibers, anti-adhesion and high-temperature-resistant reinforcing materials, and polymeric compounds, it is entirely free of pollutants and harmful substances, aligning with eco-friendly and efficient production standards.4. Automation CompatibilityDesigned to support Industry 4.0 automation, this cushion is an ideal solution for modern smart factory planning. It not only streamlines production processes but also reduces labor costs, paving the way for fully automated industrial operations.In summary, the NAWES MAT™ cushion not only serves as a functional replacement for kraft paper and silicone pads but also achieves cost reduction, meets Industry 4.0 automation standards, and ensures environmental friendliness with zero pollution.
CCL, PCB, FPC, rigid-flex boards, IC substrates, HDI and high-frequency high-speed circuit boards, aluminum substrates, ceramic substrates, new energy applications, and more.
