1.Product overview 

This product uses Sweden 's Hardox450 steel grade for deep processing by our technicians according to customer needs. The carrier plate provided by our company can meet all the pressing production needs of the existing PCB, CCL, FPC, FCCL, IC carrier plate, aluminum substrate and new energy industry.

2.Product characteristics 

Summary :

1.It can work at high temperature of 0 ~ 450 °C, non-carbonization, non-brittleness and stable expansion coefficient ;

2.High hardness, high flatness, high precision parameters in the industry ;

3.Free customization to reduce costs ;

4. Long service life

 1.     Exceptional High-Temperature Performance:

This product operates reliably in temperatures ranging from 0°C to 450°C, maintaining its structural integrity without carbonization or brittleness. Its stable expansion coefficient ensures consistent performance, even under extreme thermal conditions, making it ideal for high-temperature applications.

2.     Superior Material Properties:

Featuring high hardness, exceptional flatness, and industry-leading precision parameters, this product delivers unmatched durability and accuracy. These qualities make it a top choice for applications requiring tight tolerances and consistent results.

3.     Cost-Effective Customization:

We offer free customization to tailor the product to your specific needs, ensuring optimal performance while reducing production costs. Whether it’s adjusting dimensions, thickness, or surface finish, our solutions are designed to maximize efficiency and value.

4.     Extended Durability:

Built to last, this product boasts a long service life, resisting wear, corrosion, and fatigue even under continuous use in demanding environments. Its durability minimizes downtime and maintenance costs, providing a reliable and cost-effective solution for your operations.

3.Application scope 

for PCB, CCL, FPC, FCCL, IC carrier board, aluminum substrate and new energy pressing production needs

 Our product is specifically designed to address the pressing production requirements of a wide range of advanced industries, including:

1.     PCB (Printed Circuit Board): Ensures precise lamination and uniform pressure distribution for high-quality, multi-layer circuit boards.

2.     CCL (Copper Clad Laminate): Delivers consistent thermal and mechanical stability for reliable copper-clad laminates.

3.     FPC (Flexible Printed Circuit): Provides the precision and flexibility needed for delicate, high-performance flexible circuits.

4.     FCCL (Flexible Copper Clad Laminate): Offers exceptional flatness and thermal stability for bonding thin copper layers to flexible substrates.

5.     IC Carrier Board: Supports the high-precision manufacturing of integrated circuit carriers, meeting tight tolerance requirements.

6.     Aluminum Substrate: Withstands high temperatures and ensures uniform pressure for producing durable and thermally efficient aluminum substrates.

7.     New Energy: Meets the demanding production needs of solar panels, batteries, and other renewable energy components, ensuring reliability in high-heat environments.

4.Product price 

 Customized pricing according to customers

Note : Product attributes : production thickness 3 ~ 16mm, width, length, can be customized to meet customer needs

( according to the applicable product specifications, and customer requirements, matching the corresponding thickness ; our products are produced by order. )