In precision industries such as electronics manufacturing, semiconductor packaging, and aerospace, the quality of lamination processes directly determines the performance and reliability of the final products. As a leading domestic manufacturer of high-temperature resistant buffer pads, lamination steel plates, carrier plates, and release films, Huanyuchang Electronic Technology has always been committed to providing high-performance, long-lasting lamination buffer material solutions to global customers, helping enterprises improve production efficiency and product yield.
Core Products: Focused on Precision Pressing, Achieving Excellent Quality
1. High-Temperature Resistant Buffer Pads: Stable Load Bearing, No Worries About Temperature
The performance of the buffer pads is crucial in the pressing process of high-end electronic products such as multi-layer PCB boards, IC carrier boards, and high-frequency communication boards. Huanyu Chang Electronic Technology's high-temperature resistant buffer pads are made from special polymer composite materials and have the following advantages:
High Heat Resistance: The working temperature can reach above 300℃ continuously, with an instantaneous heat resistance of 350℃, ensuring stability in high-temperature pressing environments;
Pressure resistance and durability: Compression deformation rate <5%, with a service life exceeding thousands of cycles, significantly reducing customer replacement frequency and costs;
Stress uniformity: Unique elastic structure design effectively disperses pressure, preventing board deformation or surface defects.
2. High-precision laminating steel plate: flat and wear-resistant, precise laminating
The flatness and durability of the laminating steel plate directly affect the laminating results. XX Technology's laminating steel plates are made of high-quality alloy steel, precision ground and heat-treated, featuring:
Ultra-high flatness: flatness is controlled within ±0.02mm, ensuring no deviation in lamination.
Exceptional Wear Resistance: Surface hardness exceeds HRC50, extending service life by 30% compared to ordinary steel plates;
Customized service: supports various sizes, thicknesses, and surface treatments (such as chrome plating, nitriding, etc.), meeting diverse requirements.
3. Carrier Plate: High pressure and temperature resistance, durable and stable
For multi-layer board lamination and composite material forming processes, Huanyuchang Electronic Technology's carrier plate is based on high-strength alloy, featuring:
Excellent heat resistance: It remains deformation-free under long-term exposure to high temperature and high pressure environments.
High Mechanical Strength: Excellent bending and compression resistance, suitable for heavy-duty press working conditions;
Long service life design: Through special heat treatment processes, the service life is enhanced to industry-leading levels.
4. Release Film: Efficient demolding, smooth surface
In the production of copper-clad boards and flexible circuit boards, the quality of the release film directly affects the surface quality of the product. The release film from Huanyuchang Electronic Technology has:
Low extraction, high release properties: prevent resin residue and ensure a flawless surface on the board after lamination
Excellent heat resistance: Adapts to high-temperature bonding environments without shrinking or breaking;
Diverse options: Offers single-sided and double-sided release films with thickness options ranging from 1μm to 2000μm.
Technical Advantages: Innovation-driven, quality-first
1. Independent R&D, breaking through technical bottlenecks
Huanyuchang Electronic Technology has a professional materials R&D team and laboratory, collaborating with multiple universities and research institutions to continuously optimize product performance. For example:
The new generation of nano-composite buffer pads enhance heat resistance and rebound properties by adding nano materials;
Ultra-thin high thermal conductivity release film, which improves heat dissipation efficiency while ensuring good demolding effect, suitable for the lamination of high-power electronic components.
2. Strict Quality Control, Ensuring Stability and Reliability
Raw materials are carefully selected from global premium suppliers to ensure basic performance standards are met;
Fully automated production process combined with high-precision testing equipment (such as laser thickness gauges, electronic tensile testers, etc.), achieving 100% quality monitoring;
Products pass international standards such as ISO 9001 and UL certification, enabling exports to high-end markets like Europe, the United States, Japan, and South Korea.
3. Quick Response, Service First
National warehouse layout, supporting urgent shipping within 48 hours;
Providing value-added services such as technical consultation and process optimization to help customers solve practical production issues;
Regular follow-ups, tracking product usage, and continuously improving service.
Application Fields: Empowering High-End Manufacturing
Huanyuchang Electronic Technology's products have been widely applied in:
Electronics Industry: PCB lamination, semiconductor packaging, flexible circuit board manufacturing;
New Energy: Lithium battery separator lamination, photovoltaic module lamination;
Aerospace: Composite material forming, high-temperature structural component preparation.
Join hands to cooperate, create a better future
Huanyuchang Electronic Technology always adheres to customer needs as the orientation, providing customers with high cost-effectiveness and high reliability of pressed buffer materials through technological innovation and quality upgrading. We look forward to working together with global partners to promote the progress of the precision manufacturing industry!
