ICS Carrier Board Specific High-temperature And Pressure Resistant Buffer Material
This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation cushioning pad.
This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation cushioning pad.
After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.
After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.
In order to adapt to the new 5G materials and high-standard lamination conditions in the electronics industry, and to follow the environmental protection trend in the industry, our R & D personnel have launched a reusable 260 ° C high-temperature buffer material-Navies mat after years of research and innovation.
After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.
After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.
