About Us

  • Founding Time
  • Employee Count
  • Factory Covered
Henan Huanyuchang Electronic Technology Co., Ltd was established in 2009, headquartered in Shenzhen, factory in Henan. The company has a total investment of 200 million and covers an area of more than 78000 square meter. In the Henan factory, we have a mature R&D team, first-class production equipment, and high-level production workshops, and we continue to develop new and durable laminate products.It mainly produces electronic composite materials with high temperature and pressure resistance cushion ( Nawes Mat ) Pad, Japan Nippon Yakin pressing steel plate, Sweden Hardox Carrier plate, resistance film, release film and other products.
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Our advantage

  • DELIVERY

    DELIVERY

    Enterprise delivery logistics is a crucial part of supply chain management, which is directly related to customer satisfaction .

  • GLOBE SERVICE

    GLOBE SERVICE

    By providing high-quality, high-efficiency and high value-added services, enterprises can gain competitive advantages in the global market.

  • RESEARCH & DEVELOPMENT

    RESEARCH & DEVELOPMENT

    R & D power is the core driving force of enterprise technological innovation, which is of great significance to enhance market competitiveness .

Products

  • The Special Cushion for Pressing is a revolutionary material designed to meet the demands of modern industrial and manufacturing processes. When compared to traditional kraft paper, this innovative cushion offers a wide range of advantages, making it the preferred choice for various pressing applications.

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  • This product is composed of special grade glass fiber cloth and high molecular polymer. Compared with kraft paper, it is simple to operate, more resistant to high temperature, more stable, more environmentally friendly, more energy-saving, and can be recycled for many times.

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  • After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

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  • After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

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  • In order to adapt to the new 5G materials and high-standard lamination conditions in the electronics industry, and to follow the environmental protection trend in the industry, our R & D personnel have launched a reusable 260 ° C high-temperature buffer material-Navies mat after years of research and innovation.

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  • After the introduction of cushioning pads for CCL industry, we have developed the second generation cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation cushioning pad.

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