After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.
Compared with the first and second generation products, the cushioning performance of cushioning pads has been greatly improved.
The carrier plate provided by our company can meet all the pressing production needs of the existing PCB, CCL, FPC, FCCL, IC carrier plate, aluminum substrate and new energy industries.
This product is crafted using Sweden's premium Hardox450 steel grade, which undergoes advanced deep processing by our skilled technicians to meet specific customer requirements.
The carrier plate provided by our company can meet all the pressing production needs of the existing PCB, CCL, FPC, FCCL, IC carrier plate, aluminum substrate and new energy industry. Our High Temperature Laminated Special Bearing Plate is engineered to meet the pressing production needs of industries such as PCB, CCL, FPC, FCCL, IC carrier plate, aluminum substrate, and new energy. With its superior performance, reliability, and adaptability, it is the ideal choice for achieving high-quality results and maintaining a competitive edge in your industry. Contact us today to learn more about how our product can enhance your manufacturing processes!
The carrier plate provided by our company can meet all the pressing production needs of the existing PCB, CCL, FPC, FCCL, IC carrier plate, aluminum substrate and new energy industry.
