1. Product overview

After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

Excellent ★           Good ❏        Poor⊙

2.Product use

This material is specifically designed for the pressing process of PCB and IC carrier boards. It effectively addresses common issues such as uneven surfaces and glue deficiencies in hard boards, ensuring consistent quality and performance. Its excellent thermal conductivity and pressure resistance make it a reliable choice for advanced electronic manufacturing.

3.Product advantages

1.More resistant to high temperature, can work at 260 ° C for a long time, not carbonized, not brittle ;

2.The buffer effect is good, the heat conduction uniformity is good, the compression shrinkage is stable, the expansion coefficient of the product is stable, and the tear resistance is good ;

3.withstanding pressure ( 200 ~ 500 times ), flame retardant, non-toxic and odorless, dust-free and dust-free, good ventilation effect ;

4.Independent research and development, independent production, short production cycle, equipped with faster technical services ;

the production thickness is 1.0 ~ 10mm, which can meet the customer 's needs and record the number of times intelligently ;

6.High quality cost performance.

High-Temperature Resistance: Capable of operating at 260°C for extended periods without carbonization or brittleness, ensuring durability in high-heat environments.

Superior Cushioning Performance: Provides excellent heat conduction uniformity, stable compression shrinkage, and consistent expansion coefficients, ensuring reliable performance in every use.

Durability and Safety: With a lifespan of 200-500 presses, it is flame retardant, non-toxic, odorless, and dust-free, making it safe for both operators and the environment.

Eco-Friendly and Cost-Effective: Its reusable design reduces waste, while its energy-saving properties lower operational costs, aligning with modern environmental standards.

Customizable Thickness: Available in thicknesses ranging from 1.0mm to 10mm, it can be tailored to meet specific customer requirements.

High-Quality Cost Performance: Combining advanced technology with competitive pricing, the Heating Pad Press Cushion delivers exceptional value for industrial applications.

4.Product structure

5.Comparison of products with kraft paper

Compare Item 1	Navies pad	silicone pad	Compare Item 2	Navies pad	silicone pad
Life	◎	▲	Homogeneity of dielectric layer	◎	◯
Pressure buffering	◎	◯	Impedance controllability	◎	◯
Pressure uniformity	◎	▲	Plate thickness uniformity	◎	◎
Pressure transfer stability	◎	▲	Thick copper adaptability	◎	▲
Heat buffering	◎	◎	Chip cost	◎	▲
Heat transfer uniformity	◎	◎	Storage convenience	◎	▲
Heat conduction efficiency	◎	▲	Operation convenience	◎	▲
Processing efficiency	◎	◯	Cleanliness	◎	▲
Heat resistance	◎	◯	Recycling and reuse	◯	◎
Moisture resistance	◎	▲	Cost-effective	◎	▲

◎：Excellent             ◯：Good             ▲：Poor

6. Cost savings

Our company offers tailored cost-saving solutions for customers, enabling a 10-20% reduction in expenses compared to traditional kraft paper. By switching to the Heating Pad Press Cushion, businesses can achieve significant operational efficiencies while maintaining high-quality standards.