• High Temperature Laminated Steel Plate For IC Plate
  • High Temperature Laminated Steel Plate For IC Plate
  • High Temperature Laminated Steel Plate For IC Plate
  • High Temperature Laminated Steel Plate For IC Plate
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High Temperature Laminated Steel Plate For IC Plate

    Our business scope includes laminated steel plate business, the main agent of Japan 's gold mirror steel plate ( original import ), including NAS630 & NAS301 ( high expansion coefficient ) precipitation hardening steel plate.

    1.Product overview 

    Our business scope includes laminated steel plate business, the main agent of Japan 's gold mirror steel plate ( original import ), including NAS630 & NAS301 ( high expansion coefficient ) precipitation hardening steel plate. The product has won the pursuit of CCL / PCB customers with ultra-high hardness, extremely low surface roughness and excellent thermal conductivity. At the same time, the leveling, grinding, polishing, cutting and repairing of the pressed mirror steel plate are merged.

    2.Key Product Features

    1.         Ultra-High Hardness: Our steel plates are engineered to deliver superior hardness, ensuring long-lasting performance even under extreme conditions. This makes them particularly suitable for industries where wear resistance and structural integrity are critical.

    2.         Extremely Low Surface Roughness: The surface finish of our steel plates is meticulously controlled to achieve ultra-low roughness levels (Ra ≤ 0.15, Rz ≤ 1.5). This ensures a smooth, flawless surface that is essential for high-precision applications, such as in the production of CCL (Copper Clad Laminate) and PCB (Printed Circuit Boards).

    3.         Excellent Thermal Conductivity: The thermal management properties of our steel plates are second to none. With thermal conductivity ranging from 17-23 W/(m*K), these materials are designed to efficiently dissipate heat, making them ideal for use in high-temperature environments and applications where thermal stability is paramount.

    4.         High Expansion Coefficient: The NAS630 and NAS301 series are specifically designed to accommodate thermal expansion, making them perfect for applications where dimensional stability under varying temperatures is crucial. This feature is particularly valuable in industries such as electronics, where components are subjected to significant thermal cycling.




            Product        type

    project

    NAS630

    NAS301

    Mass-Lam

    Pin-Lam

    Mass-Lam

    Pin-Lam

    Thickness

    1.0~2.5mm

    1.0~2.5mm

    1.0~1.8mm

    1.0~1.8mm

    Width

    1300mm

    1300mm

    1060mm

    1060mm

    Length

    2410mm

    2410mm

    3150mm

    3150mm

    Plate thickness tolerance

    ±0.05mm

    ±0.05mm

    ±0.05mm

    ±0.05mm

    Roughness

    Ra0.15

    Rz1.5

    Ra0.15

    Rz1.5

    Ra0.15

    Rz1.5

    Ra0.15

    Rz1.5

    Hole-to-hole tolerances for positioning holes

    --

    +0.1/-0mm

    --

    +0.1/-0mm

    Standard bushing slot hole tolerances

    --

    +0.05/-0mm

    --

    +0.05/-0mm

    Warpage degree

    3mm/m

    3mm/m

    3mm/m

    3mm/m

    Dimension tolerances

    -0/+1mm

    -0/+1mm

    -0/+1mm

    -0/+1mm

    Endurance

    1175N/mm²)

    1175N/mm²)

    205N/mm²)

    205N/mm²)

    Tensile strength

    1400N/mm²)

    1400N/mm²)

    520N/mm²)

    520N/mm²)

    Extensionality

    5%

    5%

    40%

    40%

    Hardness ( HRC )

    50±2

    50±2

    44±2

    44±2

    3.chemical composition% 

    Type

    C

    Si

    Mn

    Ni

    Cr

    Mo

    Cu

    other

    NAS630

    0.07

    1

    1

    3~5

    15~17.5

    -

    3~5

    Nb0.15~0.45

    NAS301

    0.15

    1

    2

    6~8

    16~18

    -

    -

    -

    4.physical property

    Steel plate type

    Project

    Scope of application

    Standard value

    NAS630

    specific gravity

     

    8.03

    mean coefficient of thermal expansion

    10-6/℃)

    0-400

    10~12

    NAS301

    specific gravity

     

    8.03

    mean coefficient of thermal expansion

    10-6/℃)

    0-400

    15~17

     

    High temperature laminated steel plate for IC plate

    High temperature laminated steel plate for IC plate

    High temperature laminated steel plate for IC plate

    High temperature laminated steel plate for IC plate


    5.thermal conductivity

     

    Steel plate type

    bench markW/m*k

    0-200

    200-400

    NAS630

    18~23

    18

    23

    NAS301

    17~21

    17

    21



    6.process flow diagram

    High temperature laminated steel plate for IC plate

      7. Functional characteristics 

    Huanyuchang is the general agent of Japanese metallurgical steel plate in South China.

    Specializing in the deep processing of PCB, CCL, IC carrier board and other industrial use of the laminated steel plate

    There are two types of steel plates : ordinary steel plate ( NAS630 precipitated hardening steel plate ) and high expansion coefficient steel plate ( NAS301 precipitated hardening steel plate ).

    The company has its own processing center and production team, which can provide customers with one-stop service of vehicle, sales, processing and maintenance, so as to help improve customer quality and reduce customer cost.

    We sincerely, honest, high-precision technology, a serious attitude towards each customer, so that we are satisfied with both customers.

    Projects undertaken :

    Pressing steel plate processing, leveling, grinding, polishing, trimming, repair

    Usage : Used for PCB, CCL, FCCL, FPCB, aluminum substrate and other factories.


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