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                                            Products

                                            • Press Pad
                                              • Separator Plate
                                                • Steel Plate
                                                  • Carrier Plate
                                                    • Release Film

                                                      Featured products

                                                      Special Materials For Pressing

                                                      Special Materials For Pressing

                                                      FPC Lamination Process Materials

                                                      FPC Lamination Process Materials

                                                      High Expansion Coefficient Steel Plate

                                                      High Expansion Coefficient Steel Plate

                                                      Silicone Cushioning Pad

                                                      Silicone Cushioning Pad

                                                      FPC Special High Temperature And Pressure Buffer Pad

                                                      FPC Special High Temperature And Pressure Buffer Pad

                                                      PCB Lamination Press Pad

                                                      PCB Lamination Press Pad

                                                      FCCL Special High Temperature And Pressure Buffer Pad

                                                      FCCL Special High Temperature And Pressure Buffer Pad

                                                      PCB Special Laminated High-temperature Resistant Carrier

                                                      PCB Special Laminated High-temperature Resistant Carrier

                                                      Lamination Process Materials

                                                      Lamination Process Materials

                                                      PCB Dedicated High Temperature And Pressure Buffer Pad

                                                      PCB Dedicated High Temperature And Pressure Buffer Pad

                                                      Contact us

                                                      Address

                                                      Wuhua Road and Baocheng Road intersection southwest corner road west 10 meters,Ru'nan County,Zhumadian City, Henan Province

                                                      Email

                                                      sales@henanhyc.com、lucky@henanhyc.com、ywb4@szhycdz.com

                                                      Phone

                                                      +86-13510150278、+86-17739688867、+86-13788325233

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                                                      News

                                                      • Press-fit Cushion Wholesale: Provide cost-effective solutions for PCB manufacturers
                                                        Press-fit Cushion Wholesale: Provide cost-effective solutions for PCB manufacturers
                                                        12-16/2025
                                                      • Press-fit cushioning: a key auxiliary material in the PCB lamination process
                                                        Press-fit cushioning: a key auxiliary material in the PCB lamination process
                                                        12-15/2025
                                                      • Press Buffer Customization: Provide precise solutions for PCB manufacturing
                                                        Press Buffer Customization: Provide precise solutions for PCB manufacturing
                                                        12-15/2025
                                                      • PCB Lamination Buffer Pad: The Key Material for Enhancing Circuit Board Manufacturing Quality
                                                        PCB Lamination Buffer Pad: The Key Material for Enhancing Circuit Board Manufacturing Quality
                                                        12-15/2025
                                                      • Huanyuchang Electronic Technology creates a one-stop solution for high-end pressed buffer materials
                                                        Huanyuchang Electronic Technology creates a one-stop solution for high-end pressed buffer materials
                                                        12-14/2025
                                                      • Huanyuchang Technology appeared at the Shanghai National Convention and Exhibition Center, leading the new trend of pressed cushioning materials
                                                        Huanyuchang Technology appeared at the Shanghai National Convention and Exhibition Center, leading the new trend of pressed cushioning materials
                                                        12-14/2025
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                                                      Henan Huanyuchang Electronic Technology Co., Ltd

                                                      Address

                                                      Wuhua Road and Baocheng Road intersection southwest corner road west 10 meters,Ru'nan County,Zhumadian City, Henan Province

                                                      Email

                                                      sales@henanhyc.com、lucky@henanhyc.com、ywb4@szhycdz.com

                                                      Phone

                                                      +86-13510150278、+86-17739688867、+86-13788325233
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