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Red Bumper

This product is composed of special grade glass fiber cloth and high molecular polymer. Compared with kraft paper, it is simple to operate, more resistant to high temperature, more stable, more environmentally friendly, more energy-saving, and can be recycled for many times.

1.Core Value

Engineered for 5G high-frequency substrates and precision electronic lamination processes, this product delivers dual breakthroughs in process stability and green manufacturing through its 260°C long-term heat resistance and smart recycling system.


Performance Category
FlatnessRoughnessWear resistanceSize shrinkageThickness changeBuffer performanceHigh temperature resistanceNumber of recommendations
Red hard pad Suitable for CCL500-800
kraft paper1-5


Excellent            Good         Poor

 

2.Structural Innovation

Triple Composite System

Base Layer: Special-grade glass fiber cloth (high-temperature skeleton)

Functional Layer: High-molecular polymer (dynamic stress buffering)

Smart Layer: Cycle-counting system (precise lifespan management)


3.Product advantages

1.More resistant to high temperature, can work at 260 ° C for a long time, not carbonized, not brittle ;

2.The buffer effect is good, the heat conduction uniformity is good, the compression shrinkage is stable, the expansion coefficient of the product is stable, and the tear resistance is good ;

3.withstanding pressure ( can be compressed 500 ~ 800 times ), flame retardant, non-toxic and odorless, dust-free and dust-free, good ventilation effect ;

4.Independent research and development, independent production, short production cycle, equipped with faster technical services ;

the production thickness is 0.5 ~ 12mm, which can meet the customer 's needs and record the number of times intelligently ;

6.High quality cost performance.

 

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Red bumper

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4.Technical Support

√ 48-hour customized thickness solutions
√ On-site process parameter optimization
√ Smart recycling management system deployment
 

5.Comparison of products with kraft paper


Compare Item 1Navies padkraft paperCompare Item 2Navies padkraft paper
Chi AnHolding Effect
LifeHomogeneity of dielectric layer
Pressure bufferingImpedance controllability
Pressure uniformityPlate thickness uniformity
Pressure transfer stabilityThick copper adaptability
Heat bufferingChip cost
Heat transfer uniformityStorage convenience
Heat conduction efficiencyOperation convenience
Processing efficiencyCleanliness
Heat resistanceRecycling and reuse
Moisture resistanceCost-effective

◎:Excellent             :Good             ▲:Poor


 

6.Key Advantages of This Structure

Visual Clarity: Critical data highlighted in comparative tables

Decision Logic: Progressive flow from specs to economic benefits

Credibility: Third-party certification references enhance trust



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