Engineered for 5G high-frequency substrates and precision electronic lamination processes, this product delivers dual breakthroughs in process stability and green manufacturing through its 260°C long-term heat resistance and smart recycling system.
Performance Category | Flatness | Roughness | Wear resistance | Size shrinkage | Thickness change | Buffer performance | High temperature resistance | Number of recommendations |
| Red hard pad Suitable for CCL | ★ | ❏ | ★ | ★ | ★ | ★ | ★ | 500-800 |
| kraft paper | ❏ | ★ | ❏ | ★ | ❏ | ❏ | ⊙ | 1-5 |
Excellent ★ Good ❏ Poor⊙
Triple Composite System
Base Layer: Special-grade glass fiber cloth (high-temperature skeleton)
Functional Layer: High-molecular polymer (dynamic stress buffering)
Smart Layer: Cycle-counting system (precise lifespan management)
1.More resistant to high temperature, can work at 260 ° C for a long time, not carbonized, not brittle ;
2.The buffer effect is good, the heat conduction uniformity is good, the compression shrinkage is stable, the expansion coefficient of the product is stable, and the tear resistance is good ;
3.withstanding pressure ( can be compressed 500 ~ 800 times ), flame retardant, non-toxic and odorless, dust-free and dust-free, good ventilation effect ;
4.Independent research and development, independent production, short production cycle, equipped with faster technical services ;
the production thickness is 0.5 ~ 12mm, which can meet the customer 's needs and record the number of times intelligently ;
6.High quality cost performance.




√ 48-hour customized thickness solutions
√ On-site process parameter optimization
√ Smart recycling management system deployment
| Compare Item 1 | Navies pad | kraft paper | Compare Item 2 | Navies pad | kraft paper |
| Chi An | ◎ | ◯ | Holding Effect | ◎ | ◯ |
| Life | ◎ | ▲ | Homogeneity of dielectric layer | ◎ | ◯ |
| Pressure buffering | ◎ | ◯ | Impedance controllability | ◎ | ◯ |
| Pressure uniformity | ◎ | ▲ | Plate thickness uniformity | ◎ | ◎ |
| Pressure transfer stability | ◎ | ▲ | Thick copper adaptability | ◎ | ▲ |
| Heat buffering | ◎ | ◎ | Chip cost | ◎ | ▲ |
| Heat transfer uniformity | ◎ | ◎ | Storage convenience | ◎ | ▲ |
| Heat conduction efficiency | ◎ | ▲ | Operation convenience | ◎ | ▲ |
| Processing efficiency | ◎ | ◯ | Cleanliness | ◎ | ▲ |
| Heat resistance | ◎ | ◯ | Recycling and reuse | ◯ | ◎ |
| Moisture resistance | ◎ | ▲ | Cost-effective | ◎ | ▲ |
◎:Excellent ◯:Good ▲:Poor
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Service quality assurance : Ensure that service providers have the professional skills and good attitude to provide high-quality services. Timely response and solve problems, for customer problems and needs, service support personnel should respond in a timely manner and give effective solutions.
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