1.Product introduction
The high - temperature - resistant Press Pad is crafted from carefully selected materials. Its dimensional stability is impeccable, and it has a powerful cushioning performance. It can control the temperature uniformly, apply pressure evenly, without generating debris or sticking to the plate, and easily solves the problem of residual air bubbles. It is environmentally friendly and pollution - free, highly cost - effective, can withstand temperatures from 200 to 500 degrees Celsius, and can be used repeatedly without any issue. It is destined to replace kraft paper, significantly reducing the single - use cost and ensuring smooth progress of automated operations.
2.Component
Look at this Press Pad. It is composed by the dynamic high - elastic fibers, the hardcore reinforcement materials that are resistant to high temperature and anti - sticking, and the strong adhesion of high - molecular polymers.
3.Feature and Application
This product is mainly used in lamination processes for PCB, CCL, new energy battery panels, etc. The Press Pad is a "mainstay" in the field of electronics manufacturing. During the lamination of circuit boards, like a loyal guard, it uses its excellent cushioning performance to protect tiny electronic components from layers of pressure. Its high - temperature resistance makes it as stable as Mount Tai in high - temperature processes, ensuring that every step of an electronic product, from design to finished product, is precise.





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