HDI Laminating Process Materials

1.Product introduction

As a high - quality hot lamination material, the Laminating Process Materials fully demonstrates its advantages. Under high - temperature working conditions, its dimensions remain as stable as a rock, and its cushioning performance is outstanding. It can accurately achieve the effect of uniform temperature and pressure, fundamentally eliminating the potential problems of debris generation and steel plate adhesion, and effectively optimizing the issue of residual air bubbles. Adhering to the concept of environmental protection, it is pollution - free, has a high cost - effectiveness ratio, and excellent cushioning performance. It can be used repeatedly 200 to 500 times, easily replacing kraft paper, which greatly reduces the single - use cost and smoothly promotes automated operations.

2.Component

The Laminating Process Materials is born out of the flexibility of high - elastic fibers, the strength of anti - sticking and high - temperature - resistant reinforcement materials, and the adhesive power of high - molecular polymers. The combination of these three elements creates an excellent product.

3.Feature and Application

It is mainly used in lamination processes for CCL, aluminum - based substrates, PCB, HDI, high - frequency and high - speed boards, FCCL, solar panels, liquid - crystal panels, the middle layer (thin board) of PCB, flexible - rigid printed circuit boards (FPCB), and the middle layer (thin board) of PCB, as well as in the film pressing of new - energy batteries, etc. Currently, it is the best product to replace kraft paper and silicone pads.

With its unique properties, the Laminating Process Materials prevails in various industries. In the field of electronics manufacturing, during the circuit - board lamination process, it safeguards electronic components with its strong buffering force. Its high - temperature resistance enables it to operate smoothly in high - temperature processes, ensuring the stable operation of electronic products. In the furniture manufacturing field, it is the core guarantee for the lamination of various types of boards. Wood and artificial boards, buffered by it, fit tightly together, preventing bulging and lamination and enhancing the quality of furniture.

The Laminating Process Materials are a versatile and high-performance solution widely used in industries such as electronics and furniture manufacturing. With exceptional high-temperature resistance and strong buffering capabilities, they ensure reliable performance in demanding applications like PCB lamination and wood board bonding. By preventing issues such as bulging and delamination, these materials enhance product quality, durability, and cost-efficiency, making them an indispensable choice for high-temperature processes. Their adaptability and consistent results across various applications underscore their value in improving operational efficiency and reducing production costs.