• IC Board Press Pad
  • IC Board Press Pad
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IC Board Press Pad

    After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

    1. Product overview

    After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.



    PerformanceCategory
    FlatnessRoughnessWear resistanceSize shrinkageThickness changeBuffer performanceHigh temperature resistanceNumber of recommendations
    Red hard pad Suitable for PCB200-500
    Red hard pad Applicable to IC carrier board200-400
    kraft paper1-5


    Excellent            Good         Poor

    2.Product use

    This product is currently the best product to replace kraft paper and silicone pad. It is mainly used in the equal pressing process of PCB and IC carrier board. It has good thermal conductivity and can solve the problem of lack of glue such as thick copper and low residual copper rate.


    3.Innovation and Efficiency at Every Stage

    1. Independent Research and Development
    Our commitment to in-house R&D ensures continuous innovation and customization capabilities. By leveraging cutting-edge technologies and material science expertise, we develop solutions tailored to specific industrial challenges—such as creating buffer pads that withstand extreme temperatures (up to 260°C) and pressure. This autonomy allows us to rapidly prototype and refine products, ensuring they meet the highest standards of durability, thermal stability, and performance.

    2. Independent Production
    Full control over our manufacturing processes guarantees unmatched quality and consistency. By vertically integrating production, we eliminate reliance on third-party suppliers, reducing risks like supply chain delays or material inconsistencies. Our state-of-the-art facilities utilize advanced automation and precision engineering, ensuring every product—from high-temperature-resistant pads to flame-retardant solutions—adheres to strict specifications.

    3. Short Production Cycle
    Optimized workflows and agile manufacturing enable us to deliver products swiftly, with lead times reduced by up to 30% compared to industry averages. This efficiency is critical for industries like lithium battery manufacturing or PCB production, where rapid turnaround times are essential for meeting tight project deadlines or adapting to market demands.

    4. Faster Technical Services
    Our dedicated technical support team provides immediate, expert assistance—whether for troubleshooting, process optimization, or customization requests. With an average response time of under 4 hours, we ensure minimal downtime for clients. For example, our engineers recently helped a customer integrate our buffer pads into a high-pressure pressing system, resolving thermal uniformity issues within a single production cycle.

    Synergistic Advantages
    Together, these capabilities position us as a leader in high-performance industrial solutions. By combining bespoke R&D, rigorous production control, rapid delivery, and responsive support, we empower industries like CCL, PCB, and energy storage to achieve higher efficiency, lower costs, and enhanced operational reliability. Our end-to-end control over innovation and execution ensures that every product not only meets but exceeds the evolving demands of modern manufacturing.



    IC board press pad

    IC board press pad

     

    4.Product structure

    IC board press pad


    5.Comparison of products with kraft paper

    Compare Item 1Navies padBullskin paperCompare Item 2Navies padBullskin paper
    LifeHomogeneity of dielectric layer
    Pressure bufferingImpedance controllability
    Pressure uniformityPlate thickness uniformity
    Pressure transfer stabilityThick copper adaptability
    Heat bufferingChip cost
    Heat transfer uniformityStorage convenience
    Heat conduction efficiencyOperation convenience
    Processing efficiencyCleanliness
    Heat resistanceRecycling and reuse
    Moisture resistanceCost-effective

    ◎:Excellent             :Good             ▲:Poor


    6. Cost savings

    According to the actual situation of customers, our company formulates a cost saving scheme, which can save 10-20 % cost compared with conventional kraft paper according to the current customer base.

    IC board press pad

    IC board press pad




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