• IC Board Pressing Cushion
  • IC Board Pressing Cushion
  • video

IC Board Pressing Cushion

After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

1. Product overview

After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.



PerformanceCategory
FlatnessRoughnessWear resistanceSize shrinkageThickness changeBuffer performanceHigh temperature resistanceNumber of recommendations
Red hard pad Suitable for PCB200-500
Red hard padApplicable to IC carrier board200-400
kraft paper1-5


Excellent            Good         Poor

IC board pressing cushion

2.Product use

This product is currently the best product to replace kraft paper and silicone pad. It is mainly used in the equal pressing process of PCB and IC carrier board. It has good thermal conductivity and can solve the problem of lack of glue such as thick copper and low residual copper rate.


3.Customizable Thickness and Intelligent Usage Tracking

1. Versatile Thickness Range (1.0–10mm)
Our product is engineered to accommodate diverse industrial requirements with a customizable thickness range of 1.0mm to 10mm. This flexibility ensures compatibility with a wide array of applications:

Precision Applications (1.0–3.0mm): Ideal for delicate processes such as PCB lamination or IC carrier board manufacturing, where ultra-thin pads ensure minimal interference and high accuracy.

High-Pressure Applications (4.0–7.0mm): Designed for robust environments like lithium battery pressing or thick copper circuit production, offering enhanced durability and shock absorption.

Heavy-Duty Applications (8.0–10mm): Suited for extreme industrial processes requiring maximum resistance to compression and prolonged heat exposure (e.g., automotive component manufacturing).

Each thickness variant maintains uniform thermal conductivity, stable compression shrinkage, and flame-retardant properties, ensuring consistent performance across all specifications.

 

2. Intelligent Usage Tracking System
Embedded with IoT-enabled sensors, our cushioning pads feature a groundbreaking smart tracking capability that records compression cycles and environmental conditions in real time.

Automatically logs the number of compression cycles (up to 800 cycles for thicker variants), providing data-driven insights into pad lifespan.

Example Use Case:
In a high-volume lithium battery factory, the system flagged a pad nearing its 700-cycle threshold. The facility replaced it during scheduled maintenance, avoiding a costly production halt.

3. Synergy of Customization and Intelligence

Tailored Solutions: Customers select precise thicknesses via a streamlined digital platform, which also recommends optimal configurations based on their machinery and process data.

Sustainability Benefits: Intelligent tracking reduces material waste by extending pad usability, aligning with ESG goals.

Seamless Integration: Data syncs with factory IoT systems for centralized process optimization.

4. Technical Resilience
The tracking components are housed in high-temperature-resistant polymer casings, ensuring reliable operation even in 260°C environments. Dust-proof and moisture-resistant designs guarantee accuracy in harsh industrial settings.

5. Cost and Efficiency Gains
By combining adaptable thickness options with smart analytics, customers achieve:

20% Lower Material Costs

15% Energy Savings 

Zero Defect Escapes

This innovation redefines industrial cushioning, merging precision engineering with Industry 4.0 intelligence to deliver unmatched reliability, efficiency, and cost savings.


 IC board pressing cushion

4.Product structure

IC board pressing cushion


5.Comparison of products with kraft paper

Compare Item 1Navies padBullskin paperCompare Item 2Navies padBullskin paper
LifeHomogeneity of dielectric layer
Pressure bufferingImpedance controllability
Pressure uniformityPlate thickness uniformity
Pressure transfer stabilityThick copper adaptability
Heat bufferingChip cost
Heat transfer uniformityStorage convenience
Heat conduction efficiencyOperation convenience
Processing efficiencyCleanliness
Heat resistanceRecycling and reuse
Moisture resistanceCost-effective

◎:Excellent             :Good             ▲:Poor

IC board pressing cushion

IC board pressing cushion



6. Cost savings

According to the actual situation of customers, our company formulates a cost saving scheme, which can save 10-20 % cost compared with conventional kraft paper according to the current customer base.


Related Products

Get the latest price? We will reply as soon as possible (within 12 hours)