• IC Board Pressing Cushion
  • IC Board Pressing Cushion
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IC Board Pressing Cushion

    After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.

    1. Product overview

    After the introduction of cushioning pads for CCL industry, we have developed cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation of cushioning pads.



    PerformanceCategory
    FlatnessRoughnessWear resistanceSize shrinkageThickness changeBuffer performanceHigh temperature resistanceNumber of recommendations
    Red hard pad Suitable for PCB200-500
    Red hard padApplicable to IC carrier board200-400
    kraft paper1-5


    Excellent            Good         Poor

    IC board pressing cushion

    2.Product use

    This product is currently the best product to replace kraft paper and silicone pad. It is mainly used in the equal pressing process of PCB and IC carrier board. It has good thermal conductivity and can solve the problem of lack of glue such as thick copper and low residual copper rate.


    3.Customizable Thickness and Intelligent Usage Tracking

    1. Versatile Thickness Range (1.0–10mm)
    Our product is engineered to accommodate diverse industrial requirements with a customizable thickness range of 1.0mm to 10mm. This flexibility ensures compatibility with a wide array of applications:

    Precision Applications (1.0–3.0mm): Ideal for delicate processes such as PCB lamination or IC carrier board manufacturing, where ultra-thin pads ensure minimal interference and high accuracy.

    High-Pressure Applications (4.0–7.0mm): Designed for robust environments like lithium battery pressing or thick copper circuit production, offering enhanced durability and shock absorption.

    Heavy-Duty Applications (8.0–10mm): Suited for extreme industrial processes requiring maximum resistance to compression and prolonged heat exposure (e.g., automotive component manufacturing).

    Each thickness variant maintains uniform thermal conductivity, stable compression shrinkage, and flame-retardant properties, ensuring consistent performance across all specifications.

     

    2. Intelligent Usage Tracking System
    Embedded with IoT-enabled sensors, our cushioning pads feature a groundbreaking smart tracking capability that records compression cycles and environmental conditions in real time.

    Automatically logs the number of compression cycles (up to 800 cycles for thicker variants), providing data-driven insights into pad lifespan.

    Example Use Case:
    In a high-volume lithium battery factory, the system flagged a pad nearing its 700-cycle threshold. The facility replaced it during scheduled maintenance, avoiding a costly production halt.

    3. Synergy of Customization and Intelligence

    Tailored Solutions: Customers select precise thicknesses via a streamlined digital platform, which also recommends optimal configurations based on their machinery and process data.

    Sustainability Benefits: Intelligent tracking reduces material waste by extending pad usability, aligning with ESG goals.

    Seamless Integration: Data syncs with factory IoT systems for centralized process optimization.

    4. Technical Resilience
    The tracking components are housed in high-temperature-resistant polymer casings, ensuring reliable operation even in 260°C environments. Dust-proof and moisture-resistant designs guarantee accuracy in harsh industrial settings.

    5. Cost and Efficiency Gains
    By combining adaptable thickness options with smart analytics, customers achieve:

    20% Lower Material Costs

    15% Energy Savings 

    Zero Defect Escapes

    This innovation redefines industrial cushioning, merging precision engineering with Industry 4.0 intelligence to deliver unmatched reliability, efficiency, and cost savings.


     IC board pressing cushion

    4.Product structure

    IC board pressing cushion


    5.Comparison of products with kraft paper

    Compare Item 1Navies padBullskin paperCompare Item 2Navies padBullskin paper
    LifeHomogeneity of dielectric layer
    Pressure bufferingImpedance controllability
    Pressure uniformityPlate thickness uniformity
    Pressure transfer stabilityThick copper adaptability
    Heat bufferingChip cost
    Heat transfer uniformityStorage convenience
    Heat conduction efficiencyOperation convenience
    Processing efficiencyCleanliness
    Heat resistanceRecycling and reuse
    Moisture resistanceCost-effective

    ◎:Excellent             :Good             ▲:Poor

    IC board pressing cushion

    IC board pressing cushion



    6. Cost savings

    According to the actual situation of customers, our company formulates a cost saving scheme, which can save 10-20 % cost compared with conventional kraft paper according to the current customer base.


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