• ICS Carrier Board Specific High-temperature And Pressure Resistant Buffer Material
  • ICS Carrier Board Specific High-temperature And Pressure Resistant Buffer Material
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ICS Carrier Board Specific High-temperature And Pressure Resistant Buffer Material

This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation cushioning pad.

1.Product overview

After the introduction of cushioning pads for CCL industry, we have developed the second generation cushioning pads for PCB and IC carrier board industry. This product is composed of high elastic fiber and polymer, and the cushioning performance is also improved compared with the first generation cushioning pad.

Performance CategoryFlatnessRoughnessWear resistanceSize shrinkage
Thickness changeBuffer performanceHigh temperature resistanceNumber of recommendations
Red hard pad for PCB200-500
Red hard pad Applicable to IC carrier board200-400
Bullskin paper1-5


Excellent            Good         Poor

2.Product use

This product is currently the best product to replace kraft paper and silicone pad. It is mainly used in the equal pressing process of PCB and IC carrier board. It has good thermal conductivity and can solve the problem of lack of glue such as thick copper and low residual copper rate.


3.High Quality Cost Performance: Unmatched Value for Industrial Excellence

Our product redefines cost efficiency by merging premium quality with long-term economic benefits, delivering exceptional value that outperforms traditional materials like kraft paper and silicone pads.  Here’s how we achieve this balance:

1.  Superior Durability, Lower Replacement Costs

• Extended Lifespan: Withstands 500–800 compression cycles (vs. 100–200 cycles for kraft paper), reducing replacement frequency by 60–70%.

• High-Temperature Resilience: Operates continuously at 260°C without degradation, eliminating downtime caused by material failure.

• Tear and Wear Resistance: Maintains structural integrity even under extreme pressure, minimizing waste and unplanned maintenance.

Result: Customers report 20–30% annual savings on consumable costs compared to conventional solutions.

2.  Energy and Process Efficiency

• Uniform Thermal Conductivity: Reduces heat loss and ensures consistent temperature distribution, cutting energy consumption by 10–15% in heating/pressing processes.

• Stable Compression Shrinkage: Eliminates thickness deviations, reducing material waste and rework rates in precision applications like PCB manufacturing.

• Smart Usage Tracking: IoT-enabled sensors predict optimal replacement times, avoiding overuse-related defects (e.g., bubble formation) and saving 5–8% in scrap costs.

3.  Reduced Operational Downtime

• Faster Production Cycles: Short lead times (30% faster than industry averages) and agile customization ensure seamless integration into workflows.

• Predictive Maintenance Alerts: Real-time monitoring of compression cycles and environmental conditions prevents unexpected failures, boosting operational uptime by 15–20%.

Case Study: A lithium battery manufacturer reduced annual downtime by 200 hours after switching to our pads, translating to $250,000+ in saved productivity.

Conclusion: A Strategic Investment, Not Just a Purchase

By combining cutting-edge material science, smart technology, and lean manufacturing, our product delivers premium performance at a mid-range price.  It’s not just a replacement for kraft paper—it’s a transformative upgrade that drives profitability, sustainability, and operational resilience.  For industries like CCL, PCB, and lithium batteries, this is the definitive solution for achieving higher margins and lower risks in an increasingly competitive market


 

ICS carrier board specific buffer material

ICS carrier board specific high-temperature and pressure resistant buffer material

ICS carrier board specific high-temperature resistant buffer material

ICS carrier board specific buffer material


4.Product structure

ICS carrier board specific high-temperature and pressure resistant buffer material


It is suitable for middle layer physical buffering and multiple sheet replacement manual operation. It is also suitable for automation. Single sheet replaces multiple kraft paper on the surface layer.

 

5.Comparison of products with kraft paper


Compare Item 1Navies padBullskin paperCompare Item 2Navies padBullskin paper
LifeHomogeneity of dielectric layer
Pressure bufferingImpedance controllability
Pressure uniformityPlate thickness uniformity
Pressure transfer stabilityThick copper adaptability
Heat bufferingChip cost
Heat transfer uniformityStorage convenience
Heat conduction efficiencyOperation convenience
Processing efficiencyCleanliness
Heat resistanceRecycling and reuse
Moisture resistanceCost-effective

◎:Excellent             :Good             ▲:Poor



6.Environmental and Compliance Advantages

• Non-Toxic, Flame-Retardant Design: Meets strict safety and ESG standards, avoiding fines or penalties associated with hazardous materials.

• Dust-Free Operation: Reduces cleanup costs and contamination risks in cleanroom environments (e.g., IC carrier board production).

• Recyclable Materials: Aligns with circular economy goals, lowering waste disposal costs and enhancing corporate sustainability profiles.





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